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Brand Name : ZMSH
Model Number : N-type conductive SiC substrate
Place of Origin : China
MOQ : 1
Payment Terms : T/T
Delivery Time : 2-4 weeks
Diameter : 150±0.2mm
Polytype : 4H
Resistivity : 0.015-0.025ohm ·cm
layer Thickness : ≥0.4μm
Void : ≤5ea/wafer (2mm>D>0.5mm)
Front (Si-face)roughness : Ra≤0.2nm (5μm*5μm)
Edge Chip,Scratch,Crack (visual inspection) : None
TTV : ≤3μm
N-type conductive SiC substrate composite substrate 6inch for Epitaxy MBE CVD LPE
N-type conductive SiC substrate abstract
This N-type conductive SiC substrate features a 150mm diameter with a precision of ±0.2mm and utilizes the 4H polytype for superior electrical properties. The substrate exhibits a resistivity range of 0.015 to 0.025 ohm·cm, ensuring efficient conductivity. It includes a robust transfer layer thickness of at least 0.4μm, enhancing its structural integrity. The quality control limits voids to ≤ 5 per wafer, with each void measuring between 0.5mm and 2mm in diameter. These characteristics make the SiC substrate ideal for high-performance applications in power electronics and semiconductor devices, providing reliability and efficiency.
Specifications and Schematic Diagram for N-type Conductive SiC Substrate
Items | Specification | Items | Specification |
Diameter | 150±0.2mm | Front (Si-face)roughness | Ra≤0.2nm (5μm*5μm) |
Polytype Resistivity | 4H 0.015-0.025ohm ·cm | EdgeChip,Scratch,Crack (visual inspection) TTV | None ≤3μm |
Transfer layer Thickness | ≥0.4μm | Warp | ≤35μm |
Void | ≤5ea/wafer (2mm>D>0.5mm) | Thickness | 350±25μm |
N-type conductive SiC substrate properties
N-type conductive Silicon Carbide (SiC) substrates are widely used in various electronic and optoelectronic applications due to their unique properties. Here are some key properties of N-type conductive SiC substrates:
Electrical Properties:
Thermal Properties:
Mechanical Properties:
Doping Characteristics:
N-type conductive SiC substrate‘s photo
Q&A
Q:What is SiC epitaxy?
A: SiC epitaxy is the process of growing a thin, crystalline layer of silicon carbide (SiC) on a SiC substrate. This is typically done using Chemical Vapor Deposition (CVD), where gaseous precursors decompose at high temperatures to form the SiC layer. The epitaxial layer matches the crystal orientation of the substrate and can be precisely doped and controlled in thickness to achieve desired electrical properties. This process is essential for fabricating high-performance SiC devices used in power electronics, optoelectronics, and high-frequency applications, offering advantages such as high efficiency, thermal stability, and reliability.
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N-type Conductive SiC Substrate Composite Substrate 6inch For Epitaxy MBE CVD LPE Images |